Product details

Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Fully integrated solution for ultrasonic sensing
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
  • Fully integrated solution for ultrasonic sensing
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics

The PGA460 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

The PGA460 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 23
Type Title Date
* Data sheet PGA460 Ultrasonic Signal Processor and Transducer Driver datasheet (Rev. C) PDF | HTML 10 Feb 2023
Application brief Hall-Effect Sensors in Vacuum Robots PDF | HTML 22 Mar 2022
Application note Ultrasonic Sensing Basics (Rev. D) PDF | HTML 02 Dec 2021
Application note PGA460 Ultrasonic Module Hardware and Software Optimization (Rev. A) PDF | HTML 07 Apr 2021
Application brief Ultrasonic Sensing in Automated Terrain-Type and Obstacle Detection in Robotic (Rev. B) PDF | HTML 03 Jan 2021
E-book Ein Techniker-Leitfaden für Industrieroboter-Designs 25 Mar 2020
E-book E-book: An engineer’s guide to industrial robot designs 12 Feb 2020
Technical article How to choose the right proximity sensor for your design needs PDF | HTML 31 Oct 2019
Application brief Using Ultrasonic Technology for Smart Parking and Garage Gate Systems 08 Aug 2019
Application note How to select the right proximity sensor technology 19 Jul 2019
EVM User's guide PGA460PSM-EVM User's Guide 15 Jul 2019
Application brief Ultrasonic Floor-Type and Cliff Detection on Automated Vacuum Robots 15 Jul 2019
Application note PGA460 Array of Ultrasonic Transducers for Triangulation and Tracking 12 Jul 2019
Technical article Paving the way with ultrasonic sensing PDF | HTML 10 Jun 2019
Application note PGA460 Full-Bridge Driver Solutions for Ultrasonic Transducers (Rev. A) 28 Feb 2019
Design guide Ultrasonic Proximity-Sensing Module (PSM) Reference Design 09 Oct 2018
User guide PGA460-Q1 Ultrasonic Signal Conditioner EVM With Transducer User's Guide (Rev. B) 19 Mar 2018
Technical article Where are ultrasonic sensors used? – Part 2 PDF | HTML 31 Oct 2017
Technical article How ultrasonic technology improves convenience and performance in home automation PDF | HTML 05 Oct 2017
Application note PGA460 Software Development Guide (Rev. A) 22 Aug 2017
Technical article Where are ultrasonic sensors used? – Part 1 PDF | HTML 29 Jun 2017
Application note PGA460 Frequently Asked Questions (FAQ) and EVM Troubleshooting Guide 01 May 2017
User guide PGA460-Q1 EVM Quick Start Guide 17 Feb 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

BOOSTXL-PGA460 — PGA460-Q1 ultrasonic sensor signal conditioning evaluation module with transducers

Fully evaluate the PGA460 ultrasonic sensor signal conditioner with the BOOSTXL-PGA460 (+ MSP430F5529LP). The PGA460 is an integrated ultrasonic front-end with a digital signal processor that outputs time-of-flight data, echo width and amplitude information. The driver strength is configurable by a (...)
User guide: PDF
Evaluation board

PGA460PSM-EVM — PGA460 ultrasonic proximity-sensing evaluation module

For shipments to Europe, please order the equivalent signal conditioning device BOOSTXL-PGA460

The PGA460PSM evaluation module (EVM) is a small-form-factor solution showcasing double-sided printed circuit board (PCB) spacing and the supporting component requirements for the PGA460 ultrasonic (...)

User guide: PDF
Not available on TI.com
Code example or demo

SLAC741 PGA460 Energia Library and Code Example (Version 1.1.0)

lock = Requires export approval (1 minute)
Supported products & hardware

Supported products & hardware

Products
Ultrasonic sensor AFEs
PGA460 Ultrasonic signal processor and transducer driver PGA460-Q1 Automotive ultrasonic signal processor and transducer driver
Hardware development
Evaluation board
BOOSTXL-PGA460 PGA460-Q1 ultrasonic sensor signal conditioning evaluation module with transducers PGA460PSM-EVM PGA460 ultrasonic proximity-sensing evaluation module
GUI for evaluation module (EVM)

SLAC739 PGA460-Q1 EVM GUI (Version 1.0.2.0)

lock = Requires export approval (1 minute)
Supported products & hardware

Supported products & hardware

Products
Ultrasonic sensor AFEs
PGA460 Ultrasonic signal processor and transducer driver PGA460-Q1 Automotive ultrasonic signal processor and transducer driver
Hardware development
Evaluation board
BOOSTXL-PGA460 PGA460-Q1 ultrasonic sensor signal conditioning evaluation module with transducers PGA460PSM-EVM PGA460 ultrasonic proximity-sensing evaluation module
Plug-in

SIMPLELINK-SDK-SENSOR-ACTUATOR-PLUGIN Sensor and Actuator Plug-in for SimpleLink™ MCU SDKs

The Sensor and Actuator Plugin for SimpleLink™ MCU SDKs provides support for a variety of related components including optical and temperature and humidity sensors, allowing customers to easily add new features to their SimpleLink MCU-based design. API user guides are provided for each (...)

lock = Requires export approval (1 minute)
Supported products & hardware

Supported products & hardware

Products
Digital temperature sensors
TMP116 0.2C digital temperature sensor, 64-bit non-volatile memory
Ultrasonic sensor AFEs
PGA460 Ultrasonic signal processor and transducer driver
Wi-Fi products
CC3220MODA SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi CERTIFIED™ wireless module with antenna CC3220R SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with 6 TLS/SSL and 256kB RAM CC3220S SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with secure boot and 256kB RAM CC3220SF SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with 1MB Flash and 256kB RAM
Linear Hall-effect sensors
DRV5055 Ratiometric linear hall effect sensor with analog output
Humidity sensors
HDC2010 2% RH ultra-small, low-power digital relative humidity sensor HDC2080 2% RH ultra-low-power digital relative humidity sensor, interrupt/DRDY
Precision ADCs
ADS7142-Q1 Automotive 2-channel 12-bit 140-kSPS I2C-compatible ADC with programmable threshold and host wake-up
Low-power 2.4-GHz products
CC2640R2F SimpleLink™ 32-bit Arm® Cortex®-M3 Bluetooth® 5.1 Low Energy wireless MCU with 128-kB flash
Light sensors
OPT3001 Digital ambient light sensor (ALS) with high-precision human-eye response
Hardware development
BOOSTXL-ADS7142-Q1 ADS7142-Q1 2-channel 12-bit 140-kSPS I2C-compatible ADC BoosterPack™ plug-in module BOOSTXL-BASSENSORS Sensors BoosterPack plug-in module for building automation BOOSTXL-PGA460 PGA460-Q1 ultrasonic sensor signal conditioning evaluation module with transducers BOOSTXL-ULN2003 Dual Stepper Motor Driver BoosterPack featuring ULN2003 and CSD17571Q2 NexFET™ CC3220S-LAUNCHXL CC3220S LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU CC3220SF-LAUNCHXL CC3220SF LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU LAUNCHXL-CC1310 CC1310 LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU LAUNCHXL-CC1352R1 CC1352R LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LAUNCHXL-CC2640R2 CC2640R2 LaunchPad™ development kit for SimpleLink™ Bluetooth® Low Energy wireless MCU LAUNCHXL-CC26X2R1 CC26x2R LaunchPad™ development kit for multi-standard SimpleLink™ wireless MCU MSP-EXP432E401Y MSP432E401Y LaunchPad™ development kit for Ethernet SimpleLink™ MCU
Download options
Simulation model

PGA460 IBIS Model

SLAM301.ZIP (65 KB) - IBIS Model
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Reference designs

TIDA-060024 — Ultrasonic proximity-sensing module (PSM) reference design

This reference design is a small-form factor solution showcasing double-sided PCB spacing and minimum supporting component requirements for the PGA460 ultrasonic sensor signal conditioner. This module operates in a mono-static mode for single sensor transmit and receive operation to enable object (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01386 — Ultrasonic Distance Sensor with IO-Link Reference Design

This reference design features an ultrasonic distance sensor that fits in a M12 housing due to its high integration and an optimized layout. The design offers an IO-Link interface to communicate with the system control, which makes it industry 4.0 ready.  The purpose of ultrasonic (...)
Design guide: PDF
Schematic: PDF
Package Pins Download
TSSOP (PW) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos