LP-CC2652RSIP SimpleLink™ multi-protocol CC2652RSIP wireless module LaunchPad™ development kit angled board image

LP-CC2652RSIP

CC2652RSIP LaunchPad™ development kit for SimpleLink™ multi-protocol wireless MCU

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Features for the LP-CC2652RSIP

  • CC2652RSIP module supporting 2.4-GHz multi-protocol technologies
  • Access all I/O signals with the BoosterPack™ plug-in module connectors
  • Upgrade the LaunchPad firmware over-the-air from the SimpleLink starter app
  • Expand functionality with one of the BoosterPack plug-in modules available

Description for the LP-CC2652RSIP

This LaunchPad™ development kit is used to speed development with the SimpleLink™ 2.4GHz CC2652R system in package (SIP) module supporting Bluetooth®, Zigbee® and Thread. This devemplment kit is supported by the SIMPLELINK-LOWPOWER-SDK software development kit which is Bluetooth Low Energy 5.2 and Bluetooth Mesh qualified, along with latest 3.0 Zigbee certification.  The CC2652RSIP module offers a small size, 7x7mm package, with all required crystals and passives, as well as offering a low power industry leading standby current performance supporting -40 to 105 C temperature range.

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