Product details

Number of channels 8 Technology family FCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 70 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 200 Features High speed (tpd 10-50ns) Operating temperature range (°C) -55 to 125 Rating Military
Number of channels 8 Technology family FCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type Push-Pull Clock frequency (max) (MHz) 70 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 200 Features High speed (tpd 10-50ns) Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Fully Compatible With TTL Input and Output Logic Levels
  • CY54FCT273T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT273T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current

  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Fully Compatible With TTL Input and Output Logic Levels
  • CY54FCT273T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT273T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current

The \x92FCT273T devices consist of eight edge-triggered D-type flip-flops with individual D inputs and Q outputs. The common buffered-clock (CP) and master-reset (MR\) inputs load and reset all flip-flops simultaneously. These devices are edge-triggered registers. The state of each D input (one setup time before the low-to-high clock transition) is transferred to the corresponding flip-flop\x92s Q output. All outputs are forced low by a low logic level on the MR\ input.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The \x92FCT273T devices consist of eight edge-triggered D-type flip-flops with individual D inputs and Q outputs. The common buffered-clock (CP) and master-reset (MR\) inputs load and reset all flip-flops simultaneously. These devices are edge-triggered registers. The state of each D input (one setup time before the low-to-high clock transition) is transferred to the corresponding flip-flop\x92s Q output. All outputs are forced low by a low logic level on the MR\ input.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 10
Type Title Date
* Data sheet 8-Bit Registers datasheet (Rev. A) 01 Oct 2001
* SMD CY54FCT273T SMD 5962-92215 21 Jun 2016
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dec 2022
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide CYFCT Parameter Measurement Information 02 Apr 2001
Selection guide Advanced Bus Interface Logic Selection Guide 09 Jan 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
CDIP (J) 20 View options
LCCC (FK) 20 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos