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Product Info
- Fast access time from clock: 5/5.4 ns
- Fast clock rate: 166/143 MHz
- Fully synchronous operation
- Internal pipelined architecture
- 2M word x 16-bit x 4-bank
- Programmable Mode registers - CAS Latency: 2, or 3 - Burst Length: 1, 2, 4, 8, or full page - Burst Type: interleaved or linear burst - Burst stop function
- Auto Refresh and Self Refresh
- 4096 refresh cycles/64ms
- CKE power down mode
- Single +3.3V ± 0.3V power supply
- Interface: LVTTL
- 54-pin 400 mil plastic TSOP II package - Pb and Halogen Free
Electrical Characteristics
| Access Time-Max | 0.4 |
| Clock Frequency-Max (fCLK) | 400 |
| I/O Type | COMMON |
| Interleaved Burst Length | 4,8 |
| JESD-30 Code | R-PBGA-B84 |
| Memory Density | 536870912 |
| Memory IC Type | DDR DRAM |
| Memory Width | 16 |
| Number of Terminals | 84 |
| Number of Words | 33554432 |
| Number of Words Code | 32M |
| Operating Temperature-Max | 85 |
| Operating Temperature-Min | 0 |
| Organization | 32MX16 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | FBGA |
| Package Equivalence Code | BGA84,9X15,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, FINE PITCH |
| Power Supplies | 1.8 |
| Qualification Status | Not Qualified |
| Refresh Cycles | 8192 |
| Sequential Burst Length | 4,8 |
| Standby Current-Max | 0.015 |
| Sub Category | DRAMs |
| Supply Current-Max | 0.28 |
| Supply Voltage-Nom (Vsup) | 1.8 |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 |
| Terminal Position | BOTTOM |