Product details

Resolution (Bits) 10 Number of channels 1 Sample rate (Msps) 28 Gain (min) (dB) -6 Gain (max) (dB) 42 Pd (typ) (mW) 93 Supply voltage (max) (V) 3.6 Operating temperature range (°C) 0 to 85 Output data format CMOS Parallel Rating Catalog
Resolution (Bits) 10 Number of channels 1 Sample rate (Msps) 28 Gain (min) (dB) -6 Gain (max) (dB) 42 Pd (typ) (mW) 93 Supply voltage (max) (V) 3.6 Operating temperature range (°C) 0 to 85 Output data format CMOS Parallel Rating Catalog
LQFP (PT) 48 81 mm² 9 x 9
  • CCD Signal Processing:
    • Correlated Double Sampling (CDS)
    • Programmable Black Level Clamping
  • Programmable Gain Amplifier (PGA)
      –6-dB to 42-dB Gain Ranging
  • 10-Bit Digital Data Output:
    • Up to 28-MHz Conversion Rate
    • No Missing Codes
  • 77-dB Signal-To-Noise Ratio
  • Portable Operation:
    • Low Voltage: 2.7 V to 3.6 V
    • Low Power: 93 mW (Typ) at 3 V
    • Stand-By Mode: 6 mW
  • APPLICATIONS
    • DSC, DVC, Security Camera

  • CCD Signal Processing:
    • Correlated Double Sampling (CDS)
    • Programmable Black Level Clamping
  • Programmable Gain Amplifier (PGA)
      –6-dB to 42-dB Gain Ranging
  • 10-Bit Digital Data Output:
    • Up to 28-MHz Conversion Rate
    • No Missing Codes
  • 77-dB Signal-To-Noise Ratio
  • Portable Operation:
    • Low Voltage: 2.7 V to 3.6 V
    • Low Power: 93 mW (Typ) at 3 V
    • Stand-By Mode: 6 mW
  • APPLICATIONS
    • DSC, DVC, Security Camera

The VSP2270 device is a complete mixed-signal processing IC for digital cameras providing signal conditioning and analog-to-digital conversion for the output of a charge-coupled device (CCD) array. The primary CCD channel provides correlated double sampling (CDS) to extract the video information from the pixels, –6-dB to 42-dB gain range with digital control for varying illumination conditions, and black level clamping for an accurate black level reference. Input signal clamping and offset correction of the input CDS are also performed. The stable gain control is linear in dB. Additionally, the black level is quickly recovered after gain change.

The VSP2270Y device is available in a 48-lead LQFP package and the VSP2270M device is available in a 48-lead P-VQFN package. Both devices operate from a single 3-V/3.3-V supply.

The VSP2270 device is a complete mixed-signal processing IC for digital cameras providing signal conditioning and analog-to-digital conversion for the output of a charge-coupled device (CCD) array. The primary CCD channel provides correlated double sampling (CDS) to extract the video information from the pixels, –6-dB to 42-dB gain range with digital control for varying illumination conditions, and black level clamping for an accurate black level reference. Input signal clamping and offset correction of the input CDS are also performed. The stable gain control is linear in dB. Additionally, the black level is quickly recovered after gain change.

The VSP2270Y device is available in a 48-lead LQFP package and the VSP2270M device is available in a 48-lead P-VQFN package. Both devices operate from a single 3-V/3.3-V supply.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet VSP2270 CCD Signal Processor for Digital Cameras datasheet (Rev. A) 17 Apr 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins Download
LQFP (PT) 48 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos