Product details

DSP type 1 C54x DSP (max) (MHz) 160 CPU 16-bit Operating system DSP/BIOS Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 100
DSP type 1 C54x DSP (max) (MHz) 160 CPU 16-bit Operating system DSP/BIOS Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 100
LQFP (PGE) 144 484 mm² 22 x 22
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
  • 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
  • Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • Data Bus With a Bus Holder Feature
  • Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
  • 128K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM
    • Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM
  • 16K × 16-Bit On-Chip ROM Configured for Program Memory
  • Enhanced External Parallel Interface (XIO2)
  • Single-Instruction-Repeat and Block-Repeat Operations for Program Code
  • Block-Memory-Move Instructions for Better Program and Data Management
  • Instructions With a 32-Bit Long Word Operand
  • Instructions With Two- or Three-Operand Reads
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Fast Return From Interrupt
  • On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank-Switching
    • On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source
    • One 16-Bit Timer
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16)
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
  • CLKOUT Off Control to Disable CLKOUT
  • On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 144-Pin Ball Grid Array (BGA) (GGU Suffix)
  • 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
  • 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS)
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C54x and MicroStar BGA are trademarks of Texas Instruments.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
  • 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
  • Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • Data Bus With a Bus Holder Feature
  • Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
  • 128K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM
    • Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM
  • 16K × 16-Bit On-Chip ROM Configured for Program Memory
  • Enhanced External Parallel Interface (XIO2)
  • Single-Instruction-Repeat and Block-Repeat Operations for Program Code
  • Block-Memory-Move Instructions for Better Program and Data Management
  • Instructions With a 32-Bit Long Word Operand
  • Instructions With Two- or Three-Operand Reads
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Fast Return From Interrupt
  • On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank-Switching
    • On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source
    • One 16-Bit Timer
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16)
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
  • CLKOUT Off Control to Disable CLKOUT
  • On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 144-Pin Ball Grid Array (BGA) (GGU Suffix)
  • 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
  • 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS)
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C54x and MicroStar BGA are trademarks of Texas Instruments.

The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls.

The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls.

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Technical documentation

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* Data sheet SM320VC5416-EP Fixed-Point Digital Signal Processor datasheet 18 Jun 2003
* VID SM320VC5416-EP VID V6204610 21 Jun 2016

Design & development

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Debug probe

TMDSEMU200-U — XDS200 USB Debug Probe

The XDS200 is a debug probe (emulator) used for debugging TI embedded devices.  The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2.  It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a (...)

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Debug probe

TMDSEMU560V2STM-U — XDS560™ software v2 system trace USB debug probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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Debug probe

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB & Ethernet Debug Probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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Design tool

PROCESSORS-3P-SEARCH — Arm®-based MPU, Arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
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