Product details

Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 12 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 0.62 IOH (max) (mA) -0.75 Input type Standard CMOS Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (max) (Mbps) 20 Rating Military Operating temperature range (°C) -55 to 125
Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 12 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 0.62 IOH (max) (mA) -0.75 Input type Standard CMOS Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (max) (Mbps) 20 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67 CDIP_SB (JD) 14 138.9395 mm² 18.55 x 7.49
  • Quiescent current specified to 15V
  • Maximum input leakage of 1 uA at 15 V (full package-temperature range)
  • 1-V noise margin (full package-temperature range)

  • Quiescent current specified to 15V
  • Maximum input leakage of 1 uA at 15 V (full package-temperature range)
  • 1-V noise margin (full package-temperature range)

The TI-CD4011A, CD4012A, and CD4023A NAND gates provide the system designer with direct implementation of the NAND function and supplement the existing family of CMOS gates

These types are supplied in 14-lead hermetic dual-in-line ceramic packages (D and F suffixes), 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), and in chip form (H suffix).

The TI-CD4011A, CD4012A, and CD4023A NAND gates provide the system designer with direct implementation of the NAND function and supplement the existing family of CMOS gates

These types are supplied in 14-lead hermetic dual-in-line ceramic packages (D and F suffixes), 14-lead dual-in-line plastic packages (E suffix), 14-lead ceramic flat packages (K suffix), and in chip form (H suffix).

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Technical documentation

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Type Title Date
* Data sheet CMOS NAND Gates datasheet 15 Nov 2001
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 Dec 2001

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
CDIP (J) 14 View options
CDIP_SB (JD) 14 View options

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