SpecificationsDocumentsDescriptionDimensions
Brand | | AMP |
Center Key (mm in) | | Center |
Center Post | | With |
Center Retention Hole Diameter (mm (in)) | | 2.40 [0.094] |
Centerline (mm in) | | 1.27 [0.050] |
Contact Material | | Phosphor Bronze |
Contact Mating Area Plating Material | | Gold (30) |
Contact Mount | | Thru Hole |
DRAM Type | | Non-Buffered |
DRAM Voltage | | 3.3 V |
Ejector Location | | Both Ends |
Ejector Type | | Standard |
Housing Color | | Black |
Housing Flammability Rating | | UL 94V-0 |
Housing Material | | High Temperature Nylon |
Insertion Style | | Direct Insert |
Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
Module Key Type = Key1= Offset Left Key2 | | Center |
Module Orientation | | 25° |
Number of Keys | | 2 |
Number of Positions | | 168 |
Number of Rows | | Dual |
Packaging Method | | Tray |
PCB Retention Feature | | Yes |
PCB Retention Method | | Boardlock(s) |
Product Type | | DIMM 2P |
Profile | | Low |
Retention Post(s) Location | | Center |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Row-to-Row Spacing (mm (in)) | | 1.60 [0.063] |
Solder Tail Contact Plating | | Tin over Nickel |
Termination (Solder) Post Length (mm (in)) | | 3.18 [0.125] |