SpecificationsDocumentsDescriptionDimensions
Body Shape | | B |
Brand | | AMP |
Comment | | Machine applied applicator required. |
Disconnect Diameter (mm (in)) | | 1.47 [0.058] |
Insulation Support | | No |
Lead Free Solder Processes | | Not relevant for lead free process |
Material | | Beryllium Copper |
Packaging Method | | Strip |
Plating | | Tin |
Product Type | | Receptacle |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Stock Thickness (mm in) | | 0.25 [0.010] |
Wire Range (mm (AWG)) | | 0.30-1.00² [22-17] |