SpecificationsDocumentsDescriptionDimensions
| Brand | | AMP |
| Center Key (mm in) | | Center |
| Center Post | | With |
| Center Retention Hole Diameter (mm (in)) | | 2.40 [0.094] |
| Centerline (mm in) | | 1.27 [0.050] |
| Contact Material | | Phosphor Bronze |
| Contact Mating Area Plating Material | | Gold (30) |
| Contact Mount | | Thru Hole |
| DRAM Type | | Non-Buffered |
| DRAM Voltage | | 3.3 V |
| Ejector Location | | Both Ends |
| Ejector Type | | Standard |
| Housing Color | | Black |
| Housing Flammability Rating | | UL 94V-0 |
| Housing Material | | High Temperature Nylon |
| Insertion Style | | Direct Insert |
| Lead Free Solder Processes | | Wave solder capable to 240°C |
| Module Key Type = Key1= Offset Right Key2 | | Center |
| Module Orientation | | 25° |
| Number of Keys | | 2 |
| Number of Positions | | 168 |
| Number of Rows | | Dual |
| Packaging Method | | Tray |
| PCB Retention Feature | | Yes |
| PCB Retention Method | | Boardlock(s) |
| Product Type | | DIMM 2P |
| Profile | | Low |
| Retention Post(s) Location | | Center |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Row-to-Row Spacing (mm (in)) | | 1.60 [0.063] |
| Solder Tail Contact Plating | | Tin over Nickel |
| Termination (Solder) Post Length (mm (in)) | | 2.60 [0.102] |